LOCTITE GC 3W – The Game Changer

Redefining water wash solder paste

LOCTITE GC 3W – The Game Changer

Henkel’s LOCTITE GC 3W is a market breakthrough, the industry’s first-ever water wash solder paste for room temperature storage. It offers incomparable results in aqueous cleaning systems without the addition of saponifiers or co-solvents. Furthermore, post-reflow residue removal is quick and straightforward. Learn more about your benefits when using LOCTITE GC 3W with regard to stability, printing, paste management, reflow, cleanability or logistics.


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Solder paste GC GC 3W

Technical Information:

Regulatory Compliance
Halide/halogen containing Zero Halogens added
Particle Size Distribution

Type 3, 4 Type 3, 4
Performance Stable at 26.5°C 1 month 6 month
Performance Stable at 40°C
1 day 1 month
Abandon Time < 2 hours > 4 hours
Stencil Life < 4 hours > 8 hours
On-line Paste Utilization 75% > 95%
Start-up Time 4–24 hours 0 hours
Soak Temperature (Reflow) 150–180°C 150–180°C
Cleaning Time/Temperature 5-10 min @ 55–75°C 5 min @ 45–60°C
Residue Cleaning (Post Reflow) Within 24 hours Up to 7 days
SIR Post Cleaning
(in accordance with IPC9201A)
Within 24 hours Within 7 days
Voiding Performance
(in accordance with IPC TM-650 2.4.35)
< 10 % < 10 %
Slump Performance (in accordance with IPC TM-650 2.4.35) 0.3 mm 0.2 mm

No refrigeration

  • Eliminates refrigerated warehouse storage
  • Eliminates cold pack, dry ice and overnight shipping
  • Eliminates on-line startup time – no thaw period required
No refrigeration – GC 3W

Improved stability

  • On-line stencil stability: 3 days @ 80% RH
  • Paste stability: 12x over conventional
  • Elevated temperature stability: 100x over conventional
  • Improves shipping logistics management
  • Superior batch-to-batch consistency
Stability – GC 3W

Improved printing

  • Extended abandon times under high humidity production conditions
  • Extended stencil life under high-humidity production conditions
  • High yield paste volumes with lowest aspect ratio
  • Industry leader in paste-transfer efficiency
Printing – GC 3W

Improved paste management

  • On-line paste utilization to more than 95%, compared to 75%
  • Eliminates end-of-day paste scrapping to 5%, compared to 25%
Improved paste management – GC 3W

Improved reflow

  • Excellent coalescence in air for 0201, 01005 and 0.3 mm pitch components
  • After 3 days @ 80% RH, zero dewetting on long soak, high-temperature, reflow profile
  • Minimal hot slump @ 182°C, improving solder joint reliability
  • Best-in-class cosmetic appearance for Pb-free solder joints
  • New flux technology improves total pad solderability in air with reduced solder paste volumes
  • Outperforms halide-containing, industry standard formulations
Reflow – GC 3W

Improved Cleanability

  • Dual cleanability options: ultrasonic and spray under immersion 
  • Low temperature, shorter cleaning time compared to industry standard
  • Easy residue removal over the longest post-reflow cleaning time: 0201, 0402, BGA, CSP, QFP (0.23 mm pitch)
  • No change in residue removal after dual reflows
  • No additional saponifiers or co-solvents required
Water washable – GC 3W

Improved logistics

  • Flexible shipping options by ground, as opposed to air
  • Significant cost reduction by eliminating cold pack, dry ice and overnight shipping
  • Optimized, flexible supply chain
  • Eliminates refrigerated preproduction and warehouse storage
Logistics and Storage – GC 3W

Cost savings

  • Input your current soldering costs and discover your potential savings when upgrading to LOCTITE GC 10
  • Calculations customized based on local currency, weight and timeframes

Cost calculator

Cost saving


Input your requirements and discover your total potential savings when using LOCTITE solder paste in your manufacturing process.

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