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Henkel solder materials

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Solder Paste Materials Product Range

As the industry’s leader for solder paste innovations, Henkel delivers high performing products for today’s most demanding applications. Here you can obtain more information about any particular brand by visiting the product site on Henkel Electronics.

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LOCTITE DA 100

Halide-
free

No-clean

Pb-free

LOCTITE DA 100

LOCTITE DA 100 is a dispensing grade, halide-free solder paste intended for solder die-attach applications. It provides effective thermal control for copper leadframe power semiconductor devices, such as rectifiers, power transistors and is suitable for automotive and consumer packages.

 

LOCTITE LF 318M

Halide-
free

No-clean

Pb-free

LOCTITE LF 318M

This halide-free, no-clean and Pb-free solder paste has an excellent humidity resistance and a broad process window for both reflow and printing. It offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen reflow ovens and across a wide range of surface finishes.

LOCTITE GC 10

Halogen-
free

No-clean

Pb-free

LOCTITE GC 10

The first-ever temperature stable solder paste. Stable at 26.5 °C for one year and at temperatures of up to 40 °C for one month. LOCTITE GC 10 offers unbeatable printability and reflow performance.

LOCTITE HF 108

Halogen-
free

No-clean

Pb-free

LOCTITE HF 108

The LOCTITE HF 108 is a halogen-free, no-clean, high tack and low voiding Pb-free solder paste, designed for medium to large size boards. It offers an excellent fine pitch coalescence and a robust reflow process window with exceptional solderability in both air and nitrogen across a wide range of surface finishes including Immersion Ag and OSP copper.

LOCTITE HF 200

Halogen-
free

No-clean

Pb-free

LOCTITE HF 200

This halogen-free, no-clean, high tack and low voiding Pb-free solder paste is suitable for high speed printing demands and has been designed for small to medium size boards. It has an excellent abandon time, stencil work-life and fine pitch coalescence. The product provides exceptional solderability in both air and nitrogen across a wide range of challenging surface finishes including OSP copper.

LOCTITE HF 212

Halogen-
free

No-clean

Pb-free

LOCTITE HF 212

A halogen-free, no-clean, high tack, low voiding Pb-free solder paste, designed for medium to large size boards. You will benefit from an excellent abandon time, stencil work-life and fine pitch coalescence. Further advantages are the exceptional solderability in both air and nitrogen across a wide range of challenging surface finishes including OSP copper and the optimization for long soak reflow.

LOCTITE HF 250DP

Halogen-
free

No-clean

Pb-free

LOCTITE HF 250DP

A dispensing solution for all halogen-free requirements: Low voiding Pb-free solder dispensing paste of type 5, halogen-free and no-clean.

LOCTITE HF 2W

Halogen-
free

No-clean

Pb-free

LOCTITE HF 2W

SnPb water washable, halogen-free solder paste with excellent resistance to solder balling, humidity and slump.

LOCTITE GC 3W

Halogen-
free

Pb-free

Water
Wash

LOCTITE GC 3W

The new LOCTITE GC 3W is the market’s first water-washable solder paste. With temperature stability similar to that of LOCTITE GC 10, the paste offers performance stability at 26.5°C for six months and at 40°C for one month. It combines the properties of high-activity flux performance and temperature stability.

LOCTITE WS 300

Pb-free

Water
Wash

LOCTITE WS 300

A no-clean flux system, which has been formulated for Pb-free alloys. Benefit from this high-performance and water-washable solder paste. Residues are easily removed with DI water, without the need for a saponifier. It has a good open time with excellent print definition and soldering.

LOCTITE CR 32

Halide-
free

No-clean

SnPb

LOCTITE CR 32

This product is a modest residue level solder paste for printing and reflow in air. Its non-corrosive residues eliminate the need for cleaning. Furthermore, it has an excellent resistance to solder balling and is suitable for fine pitch, stencil printing applications.

LOCTITE CR 32

Halide-
free

No-clean

Pb-free

LOCTITE CR 32

Pb-free solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications. Also available in SnPb formulation

LOCTITE MP 200

Halide-
free

No-clean

SnPb

LOCTITE MP 200

This is a no-clean solder paste for high speed printing and reflow in both air and nitrogen. Its core benefits are an extended printed open time and tack life as well as its resistance to both hot and cold slump.

LOCTITE MP 218

Halide-
free

No-clean

SnPb

LOCTITE MP 218

High activity, soft residue, colorless, halide-free and no-clean: The LOCTITE MP 218 solder paste offers outstanding resistance to high temperature and humidity environments. It is suitable for a large range of assembly processes, including rheo pump, proflow and large high-density.

LOCTITE RP 15

Halide-
free

No-clean

SnPb

LOCTITE RP 15

A special, no-clean solder paste for dispensing or printing and reflow in air, where the process yield is critical. It provides an excellent open time and a good soldering activity, especially on OSP copper.

LOCTITE WS 200

SnPb

Water
Wash

LOCTITE WS 200

Benefit from this high-performance and water-washable solder paste. Residues are readily removed with DI water, without the need for a saponifier. It has a good open time with excellent print definition and soldering activity.

LOCTITE DA 100

Halide-
free

No-clean

SnPb

LOCTITE DA 100

The halide-free LOCTITE DA 100 solder paste is intended for solder die-attach applications. It provides effective thermal control for copper leadframe power semiconductor devices such as rectifiers and power transistors. It is suitable for automotive and consumer packages.

LOCTITE LM 100

No-clean

Pb-free

LOCTITE LM 100

LOCTITE LM 100 no clean flux is designed for use with low temperature Pb-free solder alloys. LOCTITE LM 100 is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.

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