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Safety Data Sheet (SDS)

LOCTITE GC 10

Safety precautions for handling and working with the material

Technical Data Sheet (TDS)

LOCTITE GC 10

Performance and technical characteristics of the material

Engineering Manual

LOCTITE GC 10

Interactive, comprehensive resource for product features and benefits, testing criteria and results, and performance summary

Handling Guidelines

LOCTITE GC 10

Processes and recommendations for handling LOCTITE GC 10

Material Set Compatibility – Conformal Coatings

LOCTITE GC 10

Compatibility testing data with Henkel conformal coatings

Material Set Compatibility – Underfills

LOCTITE GC 10

Compatibility testing data with Henkel underfills

Product Fact Sheet

LOCTITE GC 10

Introduction to the product features and benefits

Printing Performance Study

LOCTITE GC 10

Improving the PCB Assembly Manufacturing Process by Utilizing an Alternative Solder Paste: A Statistical Evaluation

Cleanability and Solubility Testing

LOCTITE GC 10

Chemistries, processes and recommendations based on third-party testing

Press Release

LOCTITE GC 10

Up-to-date media coverage

Technical Article

LOCTITE GC 10

First-Ever Temperature Stable Solder Paste Unveiled: Major Development in Solder Paste Formulation Set to Change Market Paradigms, 2015

Technical Article

LOCTITE GC 10

Temperature Stable Solder Paste Transforming Industry Mindset, 2016

Technical Article

LOCTITE GC 10

Eliminating Mid-Chip Solder Balls: A Practical Guide to Understanding and Doing Away with this Common Defect, 2017

Safety Data Sheet (SDS)

LOCTITE GC 3W

Safety precautions for handling and working with the material

Technical Data Sheet (TDS)

LOCTITE GC 3W

Performance and technical characteristics of the material

Engineering Manual

LOCTITE GC 3W

Interactive, comprehensive resource for product features and benefits, testing criteria and results, and performance summary

Handling Guidelines

LOCTITE GC 3W

Processes and recommendations for handling LOCTITE GC 3W

Product Fact Sheet

LOCTITE GC 3W

Introduction to the product features and benefits

Press Release

LOCTITE GC 3W

Up-to-date media coverage

Mid-Chip Solder Ball Study

An Investigation into the Factors Influencing Mid-Chip Solder Balling and Techniques for their Elimination

Technical Article

Tombstoning Reduction via Phased-reflow Soldering, 2002

Technical Article

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules, 2011

Are you a Game Changer?

But, that’s just the start. The real game changer is what LOCTITE GC materials deliver in printing and reflow performance, yield improvement and bottom line results. What Henkel has known all along, independent testing now confirms.

 

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